电子与封装2025，Vol.25Issue(5)：78-86,9.DOI:10.16257/j.cnki.1681-1070.2025.0111
2.5D封装关键技术的研究进展
Research Progress on Key Technologies of 2.5D Packaging
马千里 1马永辉 2钟诚 3李晓 3廉重 4刘志权5
作者信息
- 1. 哈尔滨工程大学烟台研究院,山东烟台 264000||深圳先进电子材料国际创新研究院,广东 深圳 518100||中国科学院深圳先进技术研究院,广东 深圳 518055
- 2. 哈尔滨工程大学烟台研究院,山东烟台 264000
- 3. 深圳先进电子材料国际创新研究院,广东 深圳 518100
- 4. 深圳先进电子材料国际创新研究院,广东 深圳 518100||中国科学院深圳先进技术研究院,广东 深圳 518055
- 5. 中国科学院深圳先进技术研究院,广东 深圳 518055||南方科技大学半导体学院(国家卓越工程师学院),广东 深圳 518055
- 折叠
摘要
Abstract
As Moore's Law approaches its physical limits in transistor scaling,advanced packaging technologies have emerged as pivotal pathways to overcome performance bottlenecks through system miniaturization and heterogeneous integration.As a critical branch of advanced packaging,2.5D packaging enables high-density interconnects and multi-chip heterogeneous integration via silicon/glass interposers,offering advantages in high bandwidth,low latency,and compact form factors,which is widely adopted in artificial intelligence,high-performance computing,and mobile electronics.The core architectures of 2.5D packaging(e.g.,CoWoS,EMIB,and I-Cube)and their technical characteristics are systematically described,with a focused analysis of the latest advancements in key technologies,such as modular design of chiplet,process optimization of through silicon via(TSV),reliability enhancement of microbumps,interface engineering of Cu-Cu direct bonding,and multi-physics co-design of redistribution layers.Future research should focus on low-cost glass substrates,atomic-layer-deposition-enabled interface oxidation suppression,and multi-physics co-design methodologies to overcome yield and thermal management bottlenecks,thereby accelerating the adoption of 2.5D packaging in high-performance computing scenarios within the post-Moore era.关键词
2.5D封装/再布线层/微凸点/硅通孔/铜-铜直接键合Key words
2.5D packaging/redistribution layer/microbump/through silicon via/Cu-Cu direct bonding分类
电子信息工程引用本文复制引用
马千里,马永辉,钟诚,李晓,廉重,刘志权..2.5D封装关键技术的研究进展[J].电子与封装,2025,25(5):78-86,9.
