电子与封装2025，Vol.25Issue(5)：87-109,23.DOI:10.16257/j.cnki.1681-1070.2025.0121
混合键合中铜焊盘的微纳结构设计与工艺优化研究进展
Research Progress on Micro-Nano Structure Design and Process Optimization of Copper Pad in Hybrid Bonding
摘要
Abstract
As the scaling of transistors gradually decelerates,advanced packaging and three-dimensional integration technologies have emerged as crucial pathways for the continuous enhancement of integrated circuit system performance.Hybrid bonding,a bonding process with high-density three-dimensional integration capabilities,is playing an increasingly important role in applications such as artificial intelligence chip manufacturing.The copper pad serves as the interface for signal transmission and power supply in hybrid bonding,and its physicochemical properties determine the yield and reliability of the process.At present,leading international semiconductor companies have made remarkable progress in the field of hybrid bonding copper pad technology,not only establishing a systematic process of high-density metallization-plasma activation-low temperature bonding,but also reducing the key dimensions(diameter and pitch)of the copper pad to the sub-micron level through technical iterations.In contrast,China's universities and scientific research institutions are still in the early stage of exploration in the research of hybrid bonding copper pad,and compared with the international advanced level,there is still a significant gap in the process capability and technology accumulation to achieve ultra-high density hybrid bonding.The effects of the geometric morphology,surface chemical characteristics,and grain structure of copper pads on bonding performance are systematically discussed.The optimization strategies and technical adjustments in this field are summarized,which provide references for the related research on improving the capability of hybrid bonding processes.关键词
混合键合/先进封装/铜焊盘/表面改性/晶粒控制Key words
hybrid bonding/advanced packaging/copper pad/surface modification/grain control分类
电子信息工程引用本文复制引用
杨刚力,常柳,于道江,李亚男,朱宏佳,丁子扬,李力一..混合键合中铜焊盘的微纳结构设计与工艺优化研究进展[J].电子与封装,2025,25(5):87-109,23.基金项目
国家自然科学基金(92373204) （92373204）
江苏省自然科学基金(BK20230830) （BK20230830）
东南大学青年跨学科研究计划(2024FGC1005) （2024FGC1005）
