电子与封装2025，Vol.25Issue(5)：110-121,12.DOI:10.16257/j.cnki.1681-1070.2025.0141
先进封装中铜柱微凸点互连技术研究进展
Research Progress of Copper Pillar Micro-Bump Interconnect Technology in Advanced Packaging
摘要
Abstract
Ultra-high density interconnection and three-dimensional heterogeneous integration are the current development trends of microelectronics technology.Copper pillar micro-bumps,as the core technology of advanced packaging interconnections,provide high-performance and diversified application solutions.The principles,characteristics and challenges of solder copper pillar micro-bump interconnections are discussed,recent advancements in transient liquid-phase and solid-state diffusion interconnection technologies are described in detail,different schemes of nano-material-modified copper pillar micro-bump interconnections are outlined,and the interconnection characteristics and performance of various materials are analyzed.Finally,the future directions of copper pillar micro-bump interconnection technology are summarized.关键词
先进封装/铜柱微凸点/焊料/纳米材料Key words
advanced packaging/copper pillar micro-bump/solder/nano-material分类
电子信息工程引用本文复制引用
张冉远,翁铭,黄文俊,张昱,杨冠南,黄光汉,崔成强..先进封装中铜柱微凸点互连技术研究进展[J].电子与封装,2025,25(5):110-121,12.基金项目
国家自然科学基金面上项目(62174039) （62174039）
