电子与封装2025，Vol.25Issue(5)：122-125,4.DOI:10.16257/j.cnki.1681-1070.2025.0062
塑封集成电路焊锡污染影响与分析
Impact and Analysis of Solder Contamination on Molded IC
邱志述 1胡敏1
作者信息
- 1. 乐山无线电股份有限公司,四川乐山 614000
- 折叠
摘要
Abstract
Molded integrated circuits(IC)reliability issue caused by ionic contamination due to package moisture erosion is more common,which caused by solder contamination of printed circuit boards is not much.The actual case of IC reliability failure caused by printed circuit board solder contamination is introduced,the conditions for the occurrence of solder contamination is pointed out,and it is concluded that solder contamination may lead to IC reliability failure by analyzing the elemental composition of IC molding body.By heating the failed product and aging it again,the IC appears to get better and fail again.In principle,it explains that solder contamination of IC package is not recoverable and may fail again under certain conditions.Suggestions are given to SMT engineers to avoid reliability failures caused by similar solder contaminated IC.关键词
回流焊/波峰焊/印刷电路板/表面安装技术Key words
reflow soldering/wave soldering/printed circuit board/SMT分类
电子信息工程引用本文复制引用
邱志述,胡敏..塑封集成电路焊锡污染影响与分析[J].电子与封装,2025,25(5):122-125,4.
