摘要
Abstract
Particle impact noise detection(PIND)failure analysis and noise particle control for hermetic semiconductor devices has become an indispensable part of packaging.With the increasing integration and complexity of packages,PIND failures caused by particles are becoming more and more difficult to control.How to reduce the particles of hermetic semiconductor devices is one of the research contents of package reliability growth.Focusing on the analysis of unreported typical cases of PIND failures in the development and production of hermetic semiconductor devices,and analyzing the source of particles by class,the idea and method of whole-process control from the design of encapsulation structure,encapsulation materials,encapsulation process,encapsulation environment and encapsulation equipment instruments and fixtures,pre-seal inspection and processing,reliable detection of PIND as well as tracking and elimination of unidentified failures are proposed.Actual production results show that this method can greatly reduce the PIND failure rate of sealed semiconductor devices,to meet the requirements of aerospace and other users,which are far higher than the harsh requirements of GJB548C-2021 method 2020.2:a maximum of 3 PIND tests,and the rejection rate of 0 in the last test;the autopsy of defective products confirms that they must not be conductive particles,or the whole batch will not be accepted.关键词
密封半导体器件/粒子碰撞噪声检测/颗粒控制/失效分析/可靠性提升Key words
sealed semiconductor device/particle impact noise detection/particle control/failure analysis/reliability growth分类
电子信息工程
