摘要
Abstract
Co-packaged optics(CPO)technology adopts advanced packaging technology to heterogeneously integrate electronic integrated circuits and photonic integrated circuits into the same package,which has the advantages of high compactness,low power consumption,and large capacity.This technology is considered a key direction for the next generation of optoelectronic technology and provides an effective implementation approach for high-performance integrated optical waveguide optical phased array(OPA).An overview of the latest research progress on three typical CPO technologies is summarized,and the different integration schemes in terms of structural integration,process feasibility,and packaging performance are analyzed.Furthermore,the latest research progress on the application of CPO technology in integrated optical waveguide OPA is summarized,and the advantages and challenges of applying CPO technology to each type of OPA are discussed.The challenges faced by the widespread application and industrialization of CPO technology in high-performance integrated optical waveguide OPA are discussed from the aspects of high-density packaging,efficient heat dissipation,and electronic-photonic co-simulation.关键词
光电共封装/光学相控阵/集成光波导/先进封装Key words
co-packaged optics/optical phased array/integrated optical waveguide/advanced packaging分类
电子信息工程
