电子与封装2025，Vol.25Issue(6)：45-48,4.DOI:10.16257/j.cnki.1681-1070.2025.0071
基于SiP微系统的DSP微组件测试方法研究
Research of DSP Microkit Testing Method Based on SiP Microsystem
赵桦 1朱江 1宋国栋 1张凯虹 1奚留华1
作者信息
- 1. 中国电子科技集团公司第五十八研究所,江苏无锡 214035
- 折叠
摘要
Abstract
SiP microsystem is a highly integrated system.It integrates one or more DSPs,NOR Flash and DDR memories,AI acceleration chips,etc.Some complex microsystems further integrate FPGA chips.Due to the internal integration of multiple microkits and the interconnection between chips,the traditional method of testing a single microkit is not applicable to the testing of microsystems.A DSP microkit testing method is proposed,which consists of a specialized testing board and a configurable PC-based debugging environment,as well as JTAG communication.Compared with a single DSP bare die testing,it can quickly and stably realize the performance testing of DSP microkits and meet the needs of mass production testing.关键词
SiP微系统/DSP微组件/大批量生产/测试板Key words
SiP microsystem/DSP microkit/mass production/test board分类
电子信息工程引用本文复制引用
赵桦,朱江,宋国栋,张凯虹,奚留华..基于SiP微系统的DSP微组件测试方法研究[J].电子与封装,2025,25(6):45-48,4.
