电子与封装2025，Vol.25Issue(6)：54-64,11.DOI:10.16257/j.cnki.1681-1070.2025.0155
先进封装中铜晶粒控制方法综述
Review of Copper Grain Control Methods in Advanced Packaging
摘要
Abstract
As the size of integrated circuit nodes shrinks,Moore's Law is slowing down,and advanced packaging has become an important technology for maintaining the continued improvement of integrated circuit performance.Copper has excellent electrical conductivity and mechanical properties,and it is widely used as an interconnect material in advanced packaging technologies.In recent years,the impact of copper grain microstructure on its performance in advanced packaging has gained significant attention.Several copper crystals with unique microstructures and superior performance have been discovered and explored for application in advanced packaging.The preparation methods and process control principles of several typical microscopic structures of copper grains in advanced packaging are reviewed,which provides a reference for improving the performance of copper interconnect materials.关键词
先进封装/纳米孪晶铜/电沉积/晶粒控制Key words
advanced packaging/nanotwined Cu/electrodeposition/grain control分类
电子信息工程引用本文复制引用
朱宏佳,杨刚力,李亚男,李力一..先进封装中铜晶粒控制方法综述[J].电子与封装,2025,25(6):54-64,11.基金项目
国家自然科学基金(92373204) （92373204）
江苏省自然科学基金(BK20230830) （BK20230830）
东南大学青年跨学科研究计划(2024FGC1005) （2024FGC1005）
