电子与封装2025，Vol.25Issue(7)：3-13,11.DOI:10.16257/j.cnki.1681-1070.2025.0128
玻璃通孔技术的射频集成应用研究进展
Advances in Radio Frequency Integration Applications of Through Glass Via Technology
摘要
Abstract
With the development of radio frequency(RF)systems towards high frequency and integration,through glass via(TGV)technology has become a core solution to break through the limitations of traditional substrates due to the low dielectric loss and high thermal conductivity of glass substrates.The manufacturing process,RF device integration innovation,and application progress of TGV technology in 5G/6G communication and millimeter wave systems are systematically reviewed.In the field of RF devices,TGV significantly improves the performance density of passive devices such as lumped inductors and capacitors through three-dimensional interconnection,and supports filter design to achieve low insertion loss and miniaturization.In antenna applications,TGV multi-layer stacking technology promotes the expansion of packaged antennas to the millimeter wave frequency band,while improving interconnection density and achieving RF heterogeneous integration through ultra-thin adapter boards and embedded fan out technology.The future development trends include innovations in high aspect ratio through-hole technology,improvement in high-frequency process consistency,and multi physics field collaborative design to break through the performance bottleneck of millimeter wave frequency band,accelerate the large-scale application of TGV in 5G/6G communications,terahertz systems,and intelligent terminals,and provide high-performance and low-cost solutions for RF integration and heterogeneous packaging.关键词
玻璃通孔/集成无源器件/滤波器/封装天线/玻璃基板/玻璃转接板/异质集成Key words
through glass via/integrated passive device/filter/packaged antenna/glass substrate/glass adapter plate/heterogeneous integration分类
信息技术与安全科学引用本文复制引用
喻甜,陈新,林景裕,钟毅,梁峻阁,顾晓峰,于大全..玻璃通孔技术的射频集成应用研究进展[J].电子与封装,2025,25(7):3-13,11.基金项目
国家自然科学基金联合基金(U2241222) （U2241222）
