电子与封装2025，Vol.25Issue(7)：14-25,12.DOI:10.16257/j.cnki.1681-1070.2025.0139
玻璃基键合技术研究进展
Research Progress of Glass-Based Bonding Technology
摘要
Abstract
With the continuous development of 3D integration technology,glass-based packaging has begun to be widely researched due to its unique advantages.Bonding technology,as the key and a major challenge of glass-based packaging,is the direct core of constructing"chip skyscrapers".It must simultaneously meet stringent requirements for physical connection strength,electrical reliability,and thermal compatibility of heterogeneous materials.Based on whether global heating is required,bonding technologies can be categorized into two groups:thermal bonding,represented by thermocompression diffusion bonding and anodic bonding,and room-temperature bonding,represented by ultrahigh-vacuum surface-activated bonding and laser bonding.Surface treatment technologies,including low-vacuum plasma activation,vacuum ultraviolet irradiation activation,and wet-chemical activation,are highly effective in reducing bonding temperature and enhancing bonding success rate.Through a review of the technical principles and characteristics of glass-based bonding technologies,their advantages and disadvantages in diverse application scenarios are evaluated,providing references and ideas for the continuous innovation and development of glass-based bonding technology.关键词
玻璃基封装/三维集成/键合技术/表面处理Key words
glass-based packaging/3D integration/bonding technology/surface treatment分类
信息技术与安全科学引用本文复制引用
傅觉锋,陈宏伟,刘金旭,张继华..玻璃基键合技术研究进展[J].电子与封装,2025,25(7):14-25,12.基金项目
深圳市科技创新局重大项目(KJZD20240903104002004) （KJZD20240903104002004）
