电子与封装2025，Vol.25Issue(7)：26-34,9.DOI:10.16257/j.cnki.1681-1070.2025.0122
应力缓冲层对玻璃基板填孔结构内应力及可靠性的调控规律研究
Regulation Study of Stress Buffer Layer on the Internal Stress and Reliability of Glass Substrate Hole-Filling Structures
摘要
Abstract
Glass has excellent advantages of high-frequency electrical properties,mechanical stability and low cost,making it an ideal material for the next generation of high-density packaging substrates.However,there is a significant difference in the coefficients of thermal expansion between glass and copper,considerable thermal stress is prone to occur during temperature changes,especially near key structures such as through glass vias(TGVs),which affects the performance and reliability of the glass substrate.Aiming at the reliability issue of the glass substrate hole-filling structure,the finite element simulation and experimental methods are used to study the introduction of an organic polymer layer at the interface between glass and copper as a stress buffer layer to regulate the internal stress at the interface and improve its reliability.The influence law of the organic polymer thickness on the thermal stress in glass filling structure is analyzed.The simulation results show that inserting a buffer layer with a thickness of 1 μm can reduce the maximum principal stress of the glass substrate by approximately 40％.The experiments further verify that the thermal stress reliability of the glass substrate with a stress buffer layer has been significantly improved.关键词
玻璃基板/玻璃通孔/可靠性/有限元模拟Key words
glass substrate/through glass via/reliability/finite element simulation分类
信息技术与安全科学引用本文复制引用
王展博,张泽玺,杨斌,郭旭,杨冠南,张昱,黄光汉,崔成强..应力缓冲层对玻璃基板填孔结构内应力及可靠性的调控规律研究[J].电子与封装,2025,25(7):26-34,9.基金项目
国家自然科学基金(62204063) （62204063）
广东省重点领域研发计划(2024B0101120004) （2024B0101120004）
