电子与封装2025，Vol.25Issue(7)：44-54,11.DOI:10.16257/j.cnki.1681-1070.2025.0156
玻璃基板在光电共封装技术中的应用
Application of Glass Substrates in Co-Packaged Optics Technology
摘要
Abstract
The increasing demand for data transmission bandwidth and energy efficiency driven by artificial intelligence and high-performance computing highlights the limitations of conventional copper interconnect technology,such as signal attenuation,high power consumption,and significant delays.Co-packaged optics technology achieves heterogeneous integration of photonic integrated circuits and electronic integrated circuits,providing a novel approach to overcoming the bottlenecks of electrical interconnects.The critical role of glass substrates as interposers in co-packaged optics technology is systematically analyzed,and the advantages of low dielectric loss,high thermal stability,wide spectral transparency,and compatibility with optical waveguide fabrication processes are illustrated.Discussions are provided on the ion-exchange technique for fabricating optical waveguides on glass substrates,the design of integrated electro-optical architectures,and representative schemes proposed by leading research institutions.In addition,challenges related to manufacturing yield,thermal management,and standardization coordination in glass substrate co-packaged optics technology are evaluated,and potential applications in data centers and related fields are projected.关键词
玻璃基板/光电共封装/光波导集成/异构集成/高密度互连Key words
glass substrate/co-packaged optics/optical waveguide integration/heterogeneous integration/high-density interconnect分类
信息技术与安全科学引用本文复制引用
陈俊伟,魏来,杨斌,樊嘉杰,崔成强,张国旗..玻璃基板在光电共封装技术中的应用[J].电子与封装,2025,25(7):44-54,11.基金项目
国家自然科学基金(52275559) （52275559）
