电子与封装2025，Vol.25Issue(7)：55-74,20.DOI:10.16257/j.cnki.1681-1070.2025.0157
玻璃通孔技术及其可靠性研究现状
Research Status of Through Glass Via Technology and Its Reliability
摘要
Abstract
Through glass via(TGV)technology,as a key technology for three-dimensional integration and advanced packaging,demonstrates broad application prospects in radio frequency devices,high-density heterogeneous integration devices,and optoelectronic co-packaged devices,owing to its excellent high-frequency performance,low dielectric loss,and superior thermomechanical stability.However,reliability issues with TGV technology remain one of the core challenges hindering the large-scale industrialization.The development history of TGV technology,its current application research status,the fabrication processes of glass interposers,and recent advancements in reliability studies are systematically reviewed.The reliability problems of key TGV interconnect structures caused by processing,design,and thermal stress are particularly discussed.After summarizing common interconnect failure mechanisms,the current shortcomings are highlighted in TGV reliability research,including studies on multi-field coupled failures,collaborative evaluation of multiple performance parameters,and the development of failure analysis methods.In response to the demand for developing next-generation high-performance devices based on TGV technology,key areas requiring further attention in future reliability research are analyzed.Insights and references for subsequent systematic reliability studies on glass interposers and TGV technology are provided.关键词
玻璃通孔技术/先进封装/可靠性研究/热机械疲劳失效/电迁移Key words
through glass via technology/advanced packaging/reliability research/thermalmechanical induced failure/electrical migration分类
信息技术与安全科学引用本文复制引用
马丙戌,王浩中,钟祥祥,向峻杉,刘沛江,周斌,杨晓锋..玻璃通孔技术及其可靠性研究现状[J].电子与封装,2025,25(7):55-74,20.基金项目
科技部国家重点研发计划(2023YFF0616600) （2023YFF0616600）
