电子与封装2025，Vol.25Issue(7)：75-84,10.DOI:10.16257/j.cnki.1681-1070.2025.0158
玻璃通孔化学镀金属化研究进展
Recent Progress in Electroless Plating Process for Metallization of Through Glass Via
摘要
Abstract
As Moore's Law gradually approaches its physical limits,the development of electronic devices toward"smaller,thinner,and more precise"dimensions simultaneously imposes higher demands on advanced packaging technologies.Glass substrates have gained significant favor among domestic and foreign enterprises and research institutions due to their advantages,including excellent high-frequency application performance,a flexibly tunable coefficient of thermal expansion(CTE),low cost,and the ready availability of large-size ultra-thin glass substrates.The metallization process,serving as a critical step in through-glass vias(TGVs),determines the electrical connection performance of integrated chips.Currently,TGV metallization is primarily implemented using physical vapor deposition(PVD)technology.However,the high cost,slow deposition rates,and poor effectiveness of PVD in processing high-aspect-ratio blind and through-holes have drawn widespread attention to wet processes for TGV metallization.Addressing this,the deposition mechanism of TGV electroless plating is elaborated upon,recent research advances and key technologies for enhancing adhesion strength between the electroless plated layer and the glass substrate are reviewed,while insights into future development directions are also provided.关键词
化学镀/玻璃通孔/黏附强度/自组装/金属氧化物Key words
electroless plating/through glass via/adhesion strength/self-assembled/metal oxide分类
信息技术与安全科学引用本文复制引用
孙鹏,钟毅,于大全..玻璃通孔化学镀金属化研究进展[J].电子与封装,2025,25(7):75-84,10.基金项目
国家自然科学基金(U2241222,62474146) （U2241222,62474146）
