电子与封装2025，Vol.25Issue(7)：104-112,9.DOI:10.16257/j.cnki.1681-1070.2025.0161
玻璃基板技术研究进展
Research Progress of Glass Substrate Technology
摘要
Abstract
Advanced packaging technologies are rapidly evolving driven by the quick development of new applications like high-performance computing and artificial intelligence.High-end substrate technology is core support that must concurrently handle the multiple performance requirements,such as high-speed and high-frequency data transmission,power management,ultra-fine-pitch interconnections,and system-level integration.Glass substrates have become a key solution to overcome the limitations of traditional packaging because of their great thermomechanical durability,very low moisture absorption,and exceptional electrical qualities.The structural features and crucial production processes of glass substrates are analyzed,with a special focus on reliability concerns,and the technical opportunities and challenges they faced are summarized.关键词
先进封装/玻璃基板技术/高密度互连/翘曲Key words
advanced packaging/glass substrate technology/high density interconnect/warpage分类
信息技术与安全科学引用本文复制引用
赵瑾,于大全,秦飞..玻璃基板技术研究进展[J].电子与封装,2025,25(7):104-112,9.基金项目
国家自然科学基金联合基金(U2241222) （U2241222）
