电子与封装2025，Vol.25Issue(9)：1-5,5.DOI:10.16257/j.cnki.1681-1070.2025.0092
基于晶圆级封装的微波变频SiP设计
Microwave Frequency-Conversion SiP Design Based on Wafer-Level Packaging
祝军 1王冰 1余启迪 1蒋乐1
作者信息
- 1. 中国电子科技集团公司第五十八研究所,江苏无锡 214035
- 折叠
摘要
Abstract
With the increasingly high-density integration of semiconductor technology,system in package(SiP)has become an important technological path for achieving miniaturized microelectronic products.A small-sized microwave frequency-conversion SiP chip based on wafer-level packaging technology is proposed,which uses a reconstituted wafer formed by redistribution layers(RDLs)and polyimide dielectric layers.The chip mainly integrates microwave monolithic circuits such as a mixer,two low-noise amplifiers,and a filter,realizing the down conversion of K-and Ka-band signals to L-band.The chip size is only 6.9 mm× 5.2 mm×0.5 mm.Compared with the traditional micro-assembly process,the microwave frequency-conversion SiP chip designed based on wafer-level packaging process has great advantages in multi-channel consistency.关键词
晶圆级封装/微波变频SiP/小型化/多通道一致性Key words
wafer-level packaging/microwave frequency-conversion SiP/miniaturization/multi-channel consistency分类
信息技术与安全科学引用本文复制引用
祝军,王冰,余启迪,蒋乐..基于晶圆级封装的微波变频SiP设计[J].电子与封装,2025,25(9):1-5,5.
