电子与封装2025，Vol.25Issue(9)：6-13,8.DOI:10.16257/j.cnki.1681-1070.2025.0093
中低温Sn-In-Bi-(Ag,Cu)焊料成分设计及可靠性研究
Composition Design and Reliability Study of Medium and Low Temperature Sn-In-Bi-(Ag,Cu)Solders
摘要
Abstract
The significant deformation of chips and substrates at elevated soldering temperatures leads to prominent soldering defects such as head-on-pillow(HoP),non-wet-open(NWO),and solder ball bridging(SBB).Traditional medium and high temperature solders,like SAC305,are no longer suitable for large-scale chip soldering processes,while the reliability of low melting point Sn-Bi solder remains unsatisfactory.In order to resolve the conflict between melting point and reliability,the melting point of Sn-Ag-Cu solder is reduced by adding In and Bi without forming low-melting-point phases in the alloy structure.Concurrently,the Ag content is optimized based on reliability evaluations encompassing solder joint reflow and high-temperature ageing microstructural evolution,drop resistance,high-temperature ageing,and thermal fatigue.The results indicate that compared to SAC305,the reflow temperature of the innovative medium-low temperature Sn-In-Bi-(Ag,Cu)solder can be reduced by 20-25℃.The enhancement of matrix strength is accompanied by the suppression of coarsening of intermetallic compound particles,thereby ensuring superior joint reliability.关键词
中低温焊料/Sn-In-Bi-(Ag,Cu)五元合金/熔点/可靠性/金属间化合物Key words
medium and low temperature solder/Sn-In-Bi-(Ag,Cu)five-element alloy/melting point/reliability/intermetallic compound分类
矿业与冶金引用本文复制引用
梁泽,蒋少强,王剑,王世堉,聂富刚,张耀,周健..中低温Sn-In-Bi-(Ag,Cu)焊料成分设计及可靠性研究[J].电子与封装,2025,25(9):6-13,8.基金项目
中兴通讯产学研合作项目(2024ZTE04-06) （2024ZTE04-06）
