电子与封装2025，Vol.25Issue(9)：18-23,6.DOI:10.16257/j.cnki.1681-1070.2025.0094
高导热高温共烧陶瓷封装外壳研究进展
Research Progress on High Thermal Conductivity High Temperature Co-Fired Ceramic Packaging Shells
尚承伟1
作者信息
- 1. 合肥芯谷微电子股份有限公司,合肥 230031
- 折叠
摘要
Abstract
High temperature co-fired ceramic(HTCC)packages play a pivotal role in electronic packaging due to their superior performance.With the widespread application of high power devices,increasingly stringent demands have been placed on the thermal management capabilities of ceramic packaging shells.The characteristics,principal architectures,thermal conduction mechanisms,and the factors affecting thermal conductivity in HTCC packages are identified.Recent advances in high thermal conductivity ceramic packaging shells are systematically summarized from thermal design of the packaging shell,ceramic thermal interface materials,and metallic thermal interface materials.The future research for high thermal conductivity packaging materials is outlined.关键词
高温共烧陶瓷/高导热/散热设计/复合金属材料/氮化铝陶瓷Key words
high temperature co-fired ceramic/high thermal conductivity/heat dissipation design/composite metal material/AlN ceramic分类
信息技术与安全科学引用本文复制引用
尚承伟..高导热高温共烧陶瓷封装外壳研究进展[J].电子与封装,2025,25(9):18-23,6.
