电子与封装2025，Vol.25Issue(9)：29-34,6.DOI:10.16257/j.cnki.1681-1070.2025.0096
不同台阶对可润湿性侧翼QFN爬锡高度的影响
Effect of Different Steps on the Height of Wettable Flank QFN Solder Climbing
赵伶俐 1杨宏珂 1赵佳磊 1付宇 1周少明1
作者信息
- 1. 郑州兴航科技有限公司,郑州 451150
- 折叠
摘要
Abstract
In recent years,quad flat no-lead(QFN)packages have gained an increasingly significant market share owing to their superior electrical and thermal performance.As a derivative of QFN,the wettable flank(WF)QFN has demonstrated significant potential in automotive electronics field due to its exceptional wettability.A solder climbing simulation method is used to investigate the influence of different single-step cutting depths and step widths on the solder climbing height of QFN devices,enabling an approximate simulation of the solder climbing when the devices are soldered on PCB.The results indicate that when the step cutting depth is ≥0.05 mm or the step width is ≥0.02 mm,the wettability of the WF QFN device is significantly enhanced,leading to a notable increase in solder climbing height.This improvement effectively enhances the reliability of subsequent soldering processes.关键词
可润湿性/侧翼QFN/切割深度/台阶宽度/爬锡高度Key words
wettable/flank QFN/cut depth/step width/solder climbing height分类
信息技术与安全科学引用本文复制引用
赵伶俐,杨宏珂,赵佳磊,付宇,周少明..不同台阶对可润湿性侧翼QFN爬锡高度的影响[J].电子与封装,2025,25(9):29-34,6.
