电子与封装2025，Vol.25Issue(9)：35-41,7.DOI:10.16257/j.cnki.1681-1070.2025.0098
高密度有机基板阻焊油墨显影与侧蚀研究
Solder Resist Ink Development and Side Etching Study on High Density Organic Substrate
杨云武 1俞宏坤 1陈君跃 2程晓玲 2沙沙 2林佳德2
作者信息
- 1. 复旦大学材料科学系,上海 200433
- 2. 日月光半导体(上海)有限公司,上海 201203
- 折叠
摘要
Abstract
Light-cured solder resist ink is a resin material used to print outside the solder area on the substrate.Its functions include preventing solder bridging and oxidation,and protecting copper circuits.However,its openings have side etching problems in processing,which can affect subsequent processes(such as the continuity of vacuum coating).Through theoretical calculations and experimental validation,combined with scanning electron microscopy and optical microscopy,the influence of process parameters such as exposure energy and development time on the lateral etching characteristics of open hole sidewalls is systematically investigated.The results show that when the exposure parameters are constant,the angle of open hole side etching becomes smaller with the extension of development time.When the development parameters are constant,the decrease of light intensity or the shortening of curing time will also make the angle of open hole side etching smaller.Comparing the two factors,the effect of development time is more significant.The study of the process parameters provides an improved idea for regulating the sidewall morphology of solder resist ink and reducing the amount of side etching.关键词
封装基板/阻焊油墨/曝光/显影/侧蚀Key words
package substrate/solder resist ink/exposure/development/side etching分类
信息技术与安全科学引用本文复制引用
杨云武,俞宏坤,陈君跃,程晓玲,沙沙,林佳德..高密度有机基板阻焊油墨显影与侧蚀研究[J].电子与封装,2025,25(9):35-41,7.
