电子与封装2025，Vol.25Issue(10)：1-8,8.DOI:10.16257/j.cnki.1681-1070.2025.0113
金属种子层PVD溅射系统在面板级先进封装中的应用
Application of Metal Seed Layer PVD Sputtering System in Panel-Level Advanced Packaging
摘要
Abstract
The physical vapor deposition(PVD)sputtering system is one of the key process equipment for panel-level advanced packaging,and its performance directly affects packaging quality and reliability.A sputtering system designed for large-size(510 mm×515 mm and above)panel-level advanced packaging is introduced.The system is equipped with multiple unit modules,enabling continuous automated sputter coating production while reducing process costs.The self-developed large-size cathode sputtering system effectively improves the deposition rate and increases target utilization to 50％.The self-developed cooling system significantly reduces substrate surface temperature,mitigates warpage,and achieves finer control.The non-uniformity of Ti and Cu film deposited on 510 mm×515 mm substrates is±3.05％and±2.36％,respectively.The adhesion strength of Ti/Cu films on glass substrates reaches 277 N/cm2,reducing risks such as seed layer delamination.The entire process is completed within a vacuum system,minimizing contamination of substrates from moisture and particles.These findings provide crucial reference and guidance for panel-level advanced packaging technologies.关键词
面板级先进封装/物理气相沉积/种子层/大尺寸平面溅射阴极系统Key words
panel-level advanced packaging/physical vapor deposition/seed layer/large-size planar sputtering cathode system分类
信息技术与安全科学引用本文复制引用
张晓军,李婷,胡小波,杨洪生,陈志强,方安安..金属种子层PVD溅射系统在面板级先进封装中的应用[J].电子与封装,2025,25(10):1-8,8.基金项目
深圳市科技计划(KQTD20190929172532382) （KQTD20190929172532382）
