电子与封装2025，Vol.25Issue(10)：18-21,4.DOI:10.16257/j.cnki.1681-1070.2025.0107
IMC厚度对大尺寸高密度电路可靠性的影响
Influence of IMC Thickness on Reliability of Large-Size and High-Density Circuit
韩星 1梁若男 1谢达 2郭俊杰1
作者信息
- 1. 无锡中微亿芯有限公司,江苏无锡 214072
- 2. 无锡中微亿芯有限公司,江苏无锡 214072||智能汽车安全技术全国重点实验室,重庆 401133
- 折叠
摘要
Abstract
With the development of electronic products and packaging systems in the direction of multi-function,miniaturization and high reliability,ball grid array(BGA)packaging technology with high-density characteristics is widely used.In the BGA packaging process,solder paste is widely used as the soldering material to interconnect the lead-free solder balls(SAC305)with the copper pads.However,the growth of intermetallic compounds(IMCs)cannot be avoided in the lead-free solder paste soldering system.The significant difference in thermal expansion coefficients between IMCs and the substrate induces thermal stress,which significantly impacts the reliability of solder balls.To study the influence of IMC thickness on circuit reliability,the finite element method is used to simulate the stress change and fatigue life of lead-free solder balls during temperature cycling under different IMC thicknesses.The results show that the formation and the thickness increase of IMCs lead to continuous increases in equivalent stress,accompanied by obvious plastic strain,which greatly reduces the fatigue life of solder balls.关键词
可靠性/金属间化合物/无铅焊球/有限元法Key words
reliability/intermetallic compound/lead-free solder ball/finite element method分类
电子信息工程引用本文复制引用
韩星,梁若男,谢达,郭俊杰..IMC厚度对大尺寸高密度电路可靠性的影响[J].电子与封装,2025,25(10):18-21,4.
