电子与封装2025，Vol.25Issue(10)：22-29,8.DOI:10.16257/j.cnki.1681-1070.2025.0116
集成电路SiP器件热应力仿真方法研究
Research on Thermal Stress Simulation Method for Integrated Circuit SiP Devices
摘要
Abstract
Thermal mismatch induced by thermal stress is identified as a primary failure factor in system-in-package(SiP)devices.Finite-element-based simulation techniques meet accuracy requirements while significantly reducing time and resource costs.However,systematic comparison and validation are lacking in current domestic and international thermal stress-strain simulation methods for SiP devices.Using a typical SiP model as an example,the thermal stress-strain simulation method for the packaging device is investigated from five aspects:convergence analysis,constraint type analysis,temperature field construction analysis,solder joint analysis,and adhesive interface analysis.Experimental comparison analysis is conducted to formulate an accurate and efficient theoretical framework for SiP device thermal stress-strain simulation,thereby providing scientific guidance for packaging design in this field.关键词
集成电路/SiP/数值模拟/热应力Key words
integrated circuit/SiP/numerical simulation/thermal stress分类
电子信息工程引用本文复制引用
吴松,王超,秦智晗,陈桃桃..集成电路SiP器件热应力仿真方法研究[J].电子与封装,2025,25(10):22-29,8.基金项目
国防基础科研项目资金(JCKY2023210C014) （JCKY2023210C014）
