电子与封装2025，Vol.25Issue(10)：30-36,7.DOI:10.16257/j.cnki.1681-1070.2025.0118
液体环氧塑封料的应用进展
Progress on the Application of Liquid Epoxy Molding Compounds
摘要
Abstract
The application fields and practical application situations of liquid epoxy molding compounds(LEMCs)are systematically sorted out and summarized.The application progress of LEMCs in fan-out wafer-level packaging(FOWLP)and high bandwidth memory(HBM)is discussed from the property requirements of the development of integrated circuit advanced packaging technologies to LEMCs,the structural design and composition of LEMCs,and the research and development of LEMCs.关键词
液体环氧塑封料/集成电路封装/高带宽存储器/回流成型底部填充(MR-MUF)Key words
liquid epoxy molding compound/integrated circuit packaging/high bandwidth memory/mass reflow-molded underfill(MR-MUF)分类
动力与电气工程引用本文复制引用
肖思成,李端怡,任茜,王振中,刘金刚..液体环氧塑封料的应用进展[J].电子与封装,2025,25(10):30-36,7.基金项目
深圳市科技计划(技术攻关重点项目)(JSGG20210629144539012) （技术攻关重点项目）
