电子与封装2025，Vol.25Issue(10)：37-43,7.DOI:10.16257/j.cnki.1681-1070.2025.0119
Sn-Pb铜核微焊点液-固界面反应及力学性能研究
Study on Liquid-Solid Interfacial Reactions and Mechanical Property of Sn-Pb Cu-Cored Micro-Solder Joints
摘要
Abstract
Cu-cored micro-solder joints exhibit superior electrical conductivity,thermal conductivity,and mechanical properties compared to traditional Sn-based micro-solder joints,enabling effective control over solder joint height.The electrodeposition process of Sn-Pb alloys is investigated,and two types of Cu-cored micro-solder balls(Cu@Sn-Pb and Cu@Ni@Sn-Pb)are fabricated through electroplating.The liquid-solid interfacial reactions of micro-solder joints are investigated during reflow at 250 ℃ and the shear fracture mechanism is explored.The results indicate that the composition of the Sn-Pb coating is influenced by Pb2+concentration,chelating agent concentration,current density,and electroplating solution temperature.The optimal electroplating results are achieved with the electroplating solution temperature at 25 ℃ and the current density of 1-2 A/dm2.After reflow,Cu/Cu@Sn-Pb/Cu micro-solder joints form scallop Cu6Sn5 and thin laminar Cu3Sn intermetallic compounds(IMCs)on both sides of the Sn-Pb/Cu-core and Sn-Pb/Cu-substrate interface.The Cu/Cu@Ni@Sn-Pb/Cu micro-solder joints form scallop-shaped(Cu,Ni)6Sn5 IMCs on the Sn-Pb/Ni/Cu-core side and Sn-Pb/Cu-substrate interface.Due to Cu-Ni interactions,the growth of Cu3Sn IMCs is suppressed,and the IMC layer thickness on the Cu substrate side is significantly greater than that on the Cu core side.Shear test results indicate that the shear strengths of Cu/Cu@Ni@Sn-Pb/Cu micro-solder joints and Cu/Cu@Sn-Pb/Cu micro-solder joints are respectively 55.2 MPa and 47.9 MPa,and the micro-solder joint strength is increased by 15.2％after Ni plating.关键词
电子封装/Sn-Pb钎料/Cu核微焊点/液-固界面反应/金属间化合物Key words
electronic packaging/Sn-Pb solder/Cu-cored micro-solder joint/liquid-solid interfacial reaction/intermetallic compound分类
电子信息工程引用本文复制引用
丁钰罡,陈湜,乔媛媛,赵宁..Sn-Pb铜核微焊点液-固界面反应及力学性能研究[J].电子与封装,2025,25(10):37-43,7.基金项目
国家自然科学基金(52075072) （52075072）
山东省重点研发计划(重大科技创新工程)(2022CXGC020408) （重大科技创新工程）
