电子与封装2025，Vol.25Issue(10)：44-48,5.DOI:10.16257/j.cnki.1681-1070.2025.0125
随机振动下QFP加固方式的可靠性研究
Reliability of QFP Reinforcement Method under Random Vibration
郭智鹏 1李佳聪 2张少华 2何文多2
作者信息
- 1. 西安恒翔控制技术有限公司,西安 710071
- 2. 中国航空工业集团西安飞行自动控制研究所,西安 710071
- 折叠
摘要
Abstract
To address the reliability issue of quad flat package(QFP)devices under random vibration,finite element analysis is employed to evaluate three reinforcement methods:underfill,corner reinforcement,and underfill combined with corner reinforcement.Using the stress-fatigue life(S-N)curve,the fatigue life of pins under random vibration is predicted,and stress distribution/failure patterns of pins are analyzed.Results show that under underfill and combined reinforcement,the primary molding location at device corners is most prone to failure.For corner reinforcement alone,significant stress concentration occurs at the primary molding location of the central pins.The fatigue life cycles are 3.23 ×103(no reinforcement),3.15 ×106(corner reinforcement),4.33×108(underfill),and 2.86×1012(combined reinforcement).All reinforcement methods improve fatigue life,with underfill outperforming corner reinforcement,and combined reinforcement providing the greatest enhancement.关键词
四侧引脚扁平封装(QFP)/可靠性/随机振动/引脚/疲劳寿命/底部填充Key words
quad flat package(QFP)/reliability/random vibration/pin/fatigue life/underfill分类
电子信息工程引用本文复制引用
郭智鹏,李佳聪,张少华,何文多..随机振动下QFP加固方式的可靠性研究[J].电子与封装,2025,25(10):44-48,5.
