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一种基于LTCC技术的低频小尺寸3dB电桥

马涛 王慷 聂梦文 潘园园

电子与封装2025,Vol.25Issue(10):78-82,5.
电子与封装2025,Vol.25Issue(10):78-82,5.DOI:10.16257/j.cnki.1681-1070.2025.0123

一种基于LTCC技术的低频小尺寸3dB电桥

Low-Frequency Small-Sized 3 dB Bridge Based on LTCC Technology

马涛 1王慷 1聂梦文 1潘园园1

作者信息

  • 1. 中国电子科技集团公司第四十三研究所,合肥 230088||微系统安徽省重点实验室,合肥 230088
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摘要

Abstract

The 3 dB bridge is widely used in communication systems for microwave signal synthesis and distribution.To meet demands for miniaturization and low-frequency applications,a low-frequency and compact bridge was developed using low-temperature co-fired ceramic technology.3 dB coupling is achieved by a broadside coupling structure,with the standing wave ratio and isolation balanced by line width adjustments.Miniaturization is accomplished through spiral and 3D wire-winding structures.A coupled line-to-ground structure is introduced to further lower the operating frequency.The device is packaged in a standard 1206 package.Measured results demonstrate good agreement with simulations,exhibiting a passband from 330 MHz to 580 MHz,with a standing wave ratio ≤ 1.5,an isolation ≥17.9 dB,an amplitude imbalance ≤1.2 dB,and a phase imbalance ≤5°.

关键词

3dB电桥/LTCC/低频/宽边耦合

Key words

3 dB bridge/LTCC/low-frequency/broadside coupling structure

分类

信息技术与安全科学

引用本文复制引用

马涛,王慷,聂梦文,潘园园..一种基于LTCC技术的低频小尺寸3dB电桥[J].电子与封装,2025,25(10):78-82,5.

基金项目

安徽省科技攻坚计划项目(202423i08050005) (202423i08050005)

电子与封装

1681-1070

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