电子元件与材料2025，Vol.44Issue(9)：1042-1048,7.DOI:10.14106/j.cnki.1001-2028.2025.0142
温度循环条件下不同尺寸类型CFP封装焊点可靠性研究
Reliability study on CFP package solder joints of different size types under temperature cycling conditions
季航 1李昆伦 1门柯润 1艾凯旋 1张玉兴 1何志刚1
作者信息
- 1. 中国工程物理研究院计量测试中心,四川绵阳 621000
- 折叠
摘要
Abstract
To explore the optimal process combination for the reliability of CFP package solder joints under temperature cycling conditions,a three-dimensional finite element simulation was established using COMSOL finite element simulation software to conduct simulation analysis of CFP package solder joints under temperature cycling conditions.The simulation results of stress and strain,equivalent viscoplastic strain,and solder joint strain life were output.Through uniform experiment and range analysis,the optimal process combination was obtained as follows:a device length of 6 mm,a solder joint height of 4 mm,a lead length of 1.2 mm,and a pad extension length of 0.38 mm.At the same time,by analyzing the two coplanarity levels of 0.15 mm and 0.30 mm,it was found that difference in lead coplanarity could cause the concentration of viscoplastic strain on the inner side of the solder joint,which would greatly reduce the solder joint life;the greater the difference,the greater the accumulation of viscoplastic strain.关键词
温度循环/CFP封装/焊点/引脚共面性Key words
temperature cycling/CFP package/solder joints/lead coplanarity引用本文复制引用
季航,李昆伦,门柯润,艾凯旋,张玉兴,何志刚..温度循环条件下不同尺寸类型CFP封装焊点可靠性研究[J].电子元件与材料,2025,44(9):1042-1048,7.
