| 注册
首页|期刊导航|电子元件与材料|L频段异构集成射频收发前端设计与实现

L频段异构集成射频收发前端设计与实现

张睿

电子元件与材料2025,Vol.44Issue(9):1058-1065,8.
电子元件与材料2025,Vol.44Issue(9):1058-1065,8.DOI:10.14106/j.cnki.1001-2028.2025.0220

L频段异构集成射频收发前端设计与实现

Design and realization of L-band heterogeneous integrated RF transceiver front-end

张睿1

作者信息

  • 1. 中国电子科技集团公司第十研究所,四川成都 610036
  • 折叠

摘要

Abstract

To meet the lightweight,miniaturized and multifunctional application requirements of RF systems below 2 GHz,a design of L-band heterogeneous integrated RF transceiver front-end microsystem with stacked architecture was proposed.Through system requirement analysis,multi-layer heterogeneous integration scheme planning,circuit design,and key transmission structure simulation verification,the overall architecture design of the microsystem was completed.Based on silicon-based micro-electro-mechanical systems(MEMS)technology and high-precision micro-assembly techniques,high-density heterogeneous integration of chips and devices with different materials,such as GaN,GaAs,CMOS,and ceramics,was achieved.The microsystem densely integrates two receive channels and one transmit channel.Measurement results show that the output power exceeds 44.9 dBm,the receive gain is 24 dB and tunable,and the noise figure is 5.49 dB.The microsystem has a volume smaller than 20 mm×20 mm×4 mm and a weight less than 4 g,making it 36 times smaller and 19 times lighter compared to traditional circuit modules.This design breaks through the spatial limitations of traditional planar circuits and provides strong support for the overall miniaturization of electronic information systems and innovative applications.

关键词

L频段/异构集成/立体堆叠/射频收发前端微系统

Key words

L-band/heterogeneous integration/3D stacking/RF transceiver front-end microsystem

分类

信息技术与安全科学

引用本文复制引用

张睿..L频段异构集成射频收发前端设计与实现[J].电子元件与材料,2025,44(9):1058-1065,8.

基金项目

国家自然科学基金(62301518) (62301518)

电子元件与材料

OA北大核心

1001-2028

访问量0
|
下载量0
段落导航相关论文