电子元件与材料2025，Vol.44Issue(9)：1098-1104,7.DOI:10.14106/j.cnki.1001-2028.2025.0225
玻璃粉掺杂对银浆导电性能的影响研究
Study on the significant enhancement of electrode conductivity using glass-doped silver paste
郭海 1聂敏 1颜廷楠1
作者信息
- 1. 深圳顺络电子股份有限公司研究所材料研发部,广东 深圳 518110
- 折叠
摘要
Abstract
Silver paste is a key raw material for devices such as solar cells,and high-temperature sintering silver paste is widely used in electronic components like ceramic substrates and chip components.The impact of silver powder characteristics(including particle size and morphology),as well as the effects of glass powder additives and sintering parameters,on the conductivity of silver electrodes after sintering on Al2O3 substrates was explored.The research results show that the elimination of internal twins in silver electrodes by glass powder is a key factor in significantly enhancing their electrical conductivity.When 1.5 μm quasi-spherical silver powder is used,the solid content in the silver paste is 85％,and the sintering temperature is 850 ℃,the silver electrode achieves an extremely high degree of densification;For an electrode with a thickness of 10 μm,the sheet resistance is 2.15 mΩ/□.The addition of glass powder with a mass fraction of 0.25％can eliminate the twins generated inside silver grains during the sintering process and avoid excessive residual glass powder in the cross-section of the silver electrode.When the sintering temperature is 880 ℃,the silver electrode exhibits the best conductivity;For a 10 μm thick electrode,the sheet resistance is 1.78 mΩ/□,which is close to the theoretical value of pure silver.关键词
银金属/导电浆料/玻璃粉/方阻Key words
silver metal/conductive paste/glass powder/sheet resistance分类
计算机与自动化引用本文复制引用
郭海,聂敏,颜廷楠..玻璃粉掺杂对银浆导电性能的影响研究[J].电子元件与材料,2025,44(9):1098-1104,7.
