电子元件与材料2025，Vol.44Issue(9)：1105-1111,7.DOI:10.14106/j.cnki.1001-2028.2025.0289
皮秒激光对陶瓷基板微裂纹及抗热冲击的影响
The effect of picosecond laser on micro-cracks and thermal shock resistance of ceramic substrate
张振文 1史长俊 2黄鹤鸣 2耿春磊 1马锐1
作者信息
- 1. 中国电子科技集团公司第43研究所,安徽 合肥 230088||合肥圣达电子科技实业有限公司,安徽 合肥 230088
- 2. 合肥圣达电子科技实业有限公司,安徽 合肥 230088
- 折叠
摘要
Abstract
Laser cutting is one of the common methods in ceramic processing,offering multiple advantages such as high efficiency,flexibility,and cleanliness.With the rapid development of power semiconductor technology,the demand for laser processing of ceramics and DBC substrates has become increasingly urgent.This study compared the effects of CO2 laser and infrared picosecond laser on ceramic edge microcracks and workpiece reliability,investigating the influence of process parameters such as power,frequency,and cutting speed of the infrared picosecond laser on the thermal impact,microcracks,flexural strength,and thermal shock resistance of DBC substrates.Using SEM microscopic analysis,the mechanism of laser processing of alumina ceramics was explored.After process optimization,with a power of 300 W,a laser cutting speed of 5000 mm/s,and a repetition frequency of 1000 kHz,the laser thermal impact was minimized,surface microcracks were significantly reduced,the three-point bending strength of the product was notably improved,and the thermal shock resistance of DBC substrates was significantly enhanced compared with that of CO2 laser cutting.关键词
红外皮秒/陶瓷覆铜板/激光切割/三点抗折Key words
infrared picosecond/DBC substrates/laser cutting/three-point bending strength分类
化学工程引用本文复制引用
张振文,史长俊,黄鹤鸣,耿春磊,马锐..皮秒激光对陶瓷基板微裂纹及抗热冲击的影响[J].电子元件与材料,2025,44(9):1105-1111,7.
