电子与封装2025，Vol.25Issue(11)：27-33,7.DOI:10.16257/j.cnki.1681-1070.2025.0178
耐高温MEMS加速度计设计及温度特性优化
Design and Temperature Characteristics Optimization of a High-Temperature Resistant MEMS Accelerometer
陈鹏旭 1任臣 1杨拥军 2王宁 1陈琳 2李明昊2
作者信息
- 1. 河北美泰电子科技有限公司,石家庄 050200
- 2. 中国电子科技集团公司第十三研究所,石家庄 050051
- 折叠
摘要
Abstract
A high-temperature resistant MEMS accelerometer with a wider operating temperature range(-55-225 ℃)was developed by leveraging high-temperature SOI ASIC fabrication processes and micro-electromechanical system(MEMS)technology,thereby broadening the application scope of MEMS accelerometers.The temperature characteristics of MEMS accelerometers in high-temperature environments were also investigated.Stress was identified as the primary factor influencing the temperature coefficient of the accelerometer's zero bias.When excessive stress is applied,the MEMS accelerometer structure becomes deformed,resulting in excessive zero offset and temperature drift.Based on finite element analysis,the high-temperature accelerometer packaging was addressed first.The temperature performance of the MEMS accelerometer was improved through optimization of the packaging stress,and the zero bias variation over the entire temperature range was reduced to within 0.002 5g.The final high-temperature accelerometer was designed with a measurement range of±50g,and a full-scale linearity better than 0.3％.These performance metrics are considered suitable for applications in complex high-temperature environments such as aerospace and oil drilling.关键词
MEMS加速度计/封装优化/有限元分析Key words
MEMS accelerometer/packaging optimization/finite element analysis分类
信息技术与安全科学引用本文复制引用
陈鹏旭,任臣,杨拥军,王宁,陈琳,李明昊..耐高温MEMS加速度计设计及温度特性优化[J].电子与封装,2025,25(11):27-33,7.
