摘要
Abstract
Aiming at the lack of reliability of SAC305 solder paste joints in harsh high-temperature environments,composite solder pastes SAC305-xSb(x=0％,2％,6％,10％,20％)are prepared by adding Sb powder particles to SAC305 solder paste by mechanical mixing.The effects of Sb particle content on the wettability,melting characteristics,post-soldering temperature resistance,porosity rate of solder joints,microstructure and mechanical properties of SAC305 solder paste are studied.The results show that the wettability and porosity rate of the composite solder paste decrease with the increase of Sb powder content,the melting characteristics and post-soldering temperature resistance increase with the increase of Sb powder content,and the shear strength of the solder joint increases first and then decreases with the increase of Sb powder content.When the mass fraction of Sb particles in the composite solder paste reaches 6％,the prepared composite solder paste exhibits the highest joint strength,mainly because Sb atoms are dissolved in β-Sn in the form of solid solution,and the microstructure of Ag3Sn phase presents a network structure distribution,strengthening the bonding strength inside the soldering layer.关键词
SAC305锡膏/Sb微粒/复合锡膏/微观组织/力学性能Key words
SAC305 solder paste/Sb particle/composite solder paste/microstructure/mechanical property分类
信息技术与安全科学
