电子与封装2025，Vol.25Issue(12)：6-11,6.DOI:10.16257/j.cnki.1681-1070.2025.0134
系统级封装模组高可靠封焊技术研究
Research on High-Reliability Soldering Technology for System-in-Package Modules
成嘉恩 1姬峰 1张鹏哲 1兰元飞 1何钦江 1兰梦伟 1王明伟1
作者信息
摘要
Abstract
As the operating frequency of RF components continues to improve and the assembly space continues to be compressed,the traditional RF components based on the two-dimensional multi-chip assembly process can no longer meet the demands for high-performance,miniaturization and lightweight products.The system-in-package process encapsulates the 3D chip stack structure into a metal-ceramic shell structure with high wiring density,and realizes vertical low-loss RF interconnections by soldering balls,which can greatly improve the integration and performance of the product.The research is carried out from the dimensions of tooling design,solder design and welding parameter design in the sealed welding process,to explore the optimal process route.The sealed welding process indexes of sealing leakage rate ≤3×10-9 Pa·m3/s and the void rate of the welding layer ≤5％are finally realized,and the overall high reliability of the module is realized.关键词
系统级封装模组/金锡焊料/对准精度/空洞率Key words
system-in-package module/gold-tin solder/alignment accuracy/void rate分类
信息技术与安全科学引用本文复制引用
成嘉恩,姬峰,张鹏哲,兰元飞,何钦江,兰梦伟,王明伟..系统级封装模组高可靠封焊技术研究[J].电子与封装,2025,25(12):6-11,6.
