电子与封装2025，Vol.25Issue(12)：12-21,10.DOI:10.16257/j.cnki.1681-1070.2025.0135
先进封装驱动下的片上互连技术发展态势研究
Research on the Development Trends of on-Chip Interconnect Technologies Driven by Advanced Packaging
王翰华 1崔忠杰1
作者信息
- 1. 中国信息通信研究院信息化与工业化融合研究所,北京 100191
- 折叠
摘要
Abstract
With the failure of Dennard scaling and the slowdown of Moore's Law,chip performance enhancement is increasingly reliant on multi-core architectures.On-chip interconnect technology has become a core factor in determining processor performance.Network-on-chip technology and advanced packaging technology provide the essential prerequisites for the large-scale increase in the number of processor cores.However,driven by advanced packaging technology,the topology of on-chip interconnects is shifting from two-dimensional to three-dimensional,making the interconnect structure more complex and the interconnect scenarios more diversified.Traditional wired interconnects based on electrical signals have shown inherent limitations.Optical interconnects and wireless interconnects,as emerging technologies,have the potential to be applied in future high-performance computing and other scenarios,becoming a powerful supplement to existing interconnect methods.关键词
片上网络/3D封装/光互连/无线互连Key words
network-on-chip/3D packaging/optical interconnect/wireless interconnect分类
信息技术与安全科学引用本文复制引用
王翰华,崔忠杰..先进封装驱动下的片上互连技术发展态势研究[J].电子与封装,2025,25(12):12-21,10.
