电子与封装2025，Vol.25Issue(12)：22-26,5.DOI:10.16257/j.cnki.1681-1070.2025.0136
窄间距多芯片自动共晶焊接工艺研究
Process Research on Narrow Pitch Multi-Chip Automatic Eutectic Soldering
摘要
Abstract
Eutectic soldering is an important chip bonding process in the field of electronic packaging.The typical eutectic soldering processes mainly include vacuum eutectic soldering and friction eutectic soldering.Compared with the vacuum eutectic soldering process,the friction eutectic soldering process has the advantages of simple operation and high flexibility,and has already been automated.With the improvement of product integration,multi-chip eutectic design has become widely adopted.Compared with the traditional single-chip eutectic,the requirements of multi-chip eutectic process are more stringent.For a narrow pitch multi-chip eutectic packaging structure,research based on the automatic friction eutectic soldering process is carried out from the aspects of nozzle design,solder pad size control,and soldering parameter settings,to realize less solder overflow and low void results.关键词
窄间距/多芯片/自动共晶焊接Key words
narrow pitch/multi-chip/automatic eutectic soldering分类
信息技术与安全科学引用本文复制引用
贾海斌,赵彬彬,高婷..窄间距多芯片自动共晶焊接工艺研究[J].电子与封装,2025,25(12):22-26,5.
