电子与封装2025，Vol.25Issue(12)：47-58,12.DOI:10.16257/j.cnki.1681-1070.2025.0169
基于基板折叠的多面立体封装技术研究进展
Research Progress on Substrate Folding-Based Polyhedral 3D Packaging Technology
摘要
Abstract
Polyhedral 3D packaging based on substrate folding consists of non-parallel substrates,representing a specialized form of 3D packaging.It offers high functional density and thermal dissipation capabilities,making it a subject of significant research value across diverse applications such as sensors and medical devices.The concept of polyhedral 3D packaging based on substrate folding is introduced and the current states of research both domestically and internationally are reviewed.The typical structures,substrate materials,assembly processes,thermal management,and representative applications of this type of packaging are systematically summarized.The distinctions between substrate folding-based polyhedral packaging technology and other 3D packaging types are analyzed,highlighting its unique advantages and salient features.Finally,development prospects in the fields of active phased array T/R modules and co-packaged optics are outlined.关键词
多面立体封装/传感器/3D封装/T/R组件/光电共封装Key words
polyhedral 3D packaging/sensor/3D packaging/T/R module/co-packaged optics分类
信息技术与安全科学引用本文复制引用
毕博,潘碑,张晋,成海峰,葛振霆,刘子玉..基于基板折叠的多面立体封装技术研究进展[J].电子与封装,2025,25(12):47-58,12.基金项目
中国电子科技集团公司第五十五研究所基础性研究项目(2308N151) （2308N151）
