电子与封装2025，Vol.25Issue(12)：59-64,6.DOI:10.16257/j.cnki.1681-1070.2025.0171
带预制焊环盖板的低成本设计与制备
Low-Cost Design and Manufacturing of Lids with Preformed Solder Rings
唐桃扣 1曹忞忞 1何晟 2丁荣峥 1颜炎洪3
作者信息
- 1. 中科芯集成电路有限公司,江苏无锡 214072
- 2. 宜兴市吉泰电子有限公司,江苏无锡 214221
- 3. 无锡中微高科电子有限公司,江苏无锡 214174
- 折叠
摘要
Abstract
Sealing electronic components using lids with preformed solder rings is a common method in high-reliability sealing processes.In the cost structure of lids with Au80Sn20 preformed solder rings,the cost of gold constitutes the dominant cost.Research has been conducted on optimizing lid plating structures,minimizing solder usage,and applying base metal solder rings.Discussions have also been held on enhancing production efficiency,ensuring yield,and improving material utilization.Exploring effective pathways to enhance sealing quality and reliability while reducing costs provides a reference solution for cost control in hermetic packages.关键词
盖板/预制焊环/电镀/点焊/密封Key words
lid/preformed solder ring/plating/spot welding/hermetic sealing分类
信息技术与安全科学引用本文复制引用
唐桃扣,曹忞忞,何晟,丁荣峥,颜炎洪..带预制焊环盖板的低成本设计与制备[J].电子与封装,2025,25(12):59-64,6.
