电子与封装2025，Vol.25Issue(12)：65-70,6.DOI:10.16257/j.cnki.1681-1070.2025.0175
某PCBA载板的翘曲变形研究与优化
Study and Optimization of Warpage Deformation of a PCBA Carrier Board
吴丽贞 1熊铃华 1刘帅 1赵可沦2
作者信息
- 1. 广电计量检测集团股份有限公司,广州 510656
- 2. 广电计量检测集团股份有限公司,广州 510656||广电计量检测(青岛)有限公司,山东青岛 266111
- 折叠
摘要
Abstract
To address soldering defects caused by carrier board warping during the surface mount technology(SMT)process of small ceramic substrate printed circuit board assemblies(PCBAs),an integrated approach combining theoretical analysis,thermo-mechanical coupled finite element simulation,and experimental validation was employed.The evolution of the three-dimensional temperature field of the carrier board and its correlation with structural deformation were systematically investigated.Simulation results indicated that direct contact with the heating stage generated significant thermal stress due to a non-uniform thermal environment,leading to carrier warpage and a consequent reduction in component yield.To mitigate this issue by buffering the transient thermal shock,an optimized solution involving the insertion of a thermal insulation pad between the carrier and the heating stage was proposed.The results demonstrated that this solution effectively reduced the temperature gradient and temperature rise rate,achieving a warpage reduction of more than 90％.With the warpage thus controlled,the component defect rate was reduced from 6.5％to below 2.0％,resulting in a significant improvement in component yield.关键词
翘曲/有限元仿真/热-力耦合/表面贴装技术Key words
warpage/finite element simulation/thermo-mechanical coupling/surface mount technology分类
信息技术与安全科学引用本文复制引用
吴丽贞,熊铃华,刘帅,赵可沦..某PCBA载板的翘曲变形研究与优化[J].电子与封装,2025,25(12):65-70,6.
