电子与封装2026，Vol.26Issue(1)：1-9,9.DOI:10.16257/j.cnki.1681-1070.2026.0001
基于晶体塑性有限元的铜-铜键合结构热疲劳行为研究
Investigation of Thermal Fatigue Behavior in Cu-Cu Bonding Structures Based on Crystal Plasticity Finite Element Method
周聪林 1雷鸣奇 2姚尧3
作者信息
- 1. 西安建筑科技大学理学院,西安 710055
- 2. 西北工业大学力学与交通运载工程学院,西安 710072
- 3. 西安建筑科技大学理学院,西安 710055||西北工业大学力学与交通运载工程学院,西安 710072
- 折叠
摘要
Abstract
In the post-Moore's Law era,advanced 3D packaging is an important way to achieve continuous improvement in chip computing power and storage density.Cu-Cu bonding is a critical technology in 3D packaging,and one of its common failure modes is the thermal stress problem caused by the mismatch in coefficient of thermal expansion(CTE)between materials.Based on the crystal plasticity theory,a temperature effects constitutive model is developed and the parameters are calibrated.Based on the Voronoi algorithm,a 3D representative volume element(RVE)model of the Cu-Cu bonding is established,and the cumulative plastic strain energy density is introduced as a fatigue indicator parameter(FIP)to predict the fatigue crack initiation.The results show that both geometric discontinuities and dislocation pile-up effect can cause stress concentration,and there is a synergistic enhancement effect between them.The cumulative plastic strain energy density can effectively predict the four failure locations of Cu-Cu bonding,while impurities/defects in the bonding interface can accelerate the failure of Cu-Cu bonding.关键词
先进三维封装/铜-铜键合/晶体塑性/有限元分析/热疲劳Key words
advanced 3D packaging/Cu-Cu bonding/crystal plasticity/finite element analysis/thermal fatigue分类
信息技术与安全科学引用本文复制引用
周聪林,雷鸣奇,姚尧..基于晶体塑性有限元的铜-铜键合结构热疲劳行为研究[J].电子与封装,2026,26(1):1-9,9.
