电子与封装2026，Vol.26Issue(1)：10-16,7.DOI:10.16257/j.cnki.1681-1070.2026.0002
基于陶瓷基板的焊接润湿性及失效机理研究
Research on Welding Wettability and Failure Mechanism Based on Ceramic Substrate
陈柱1
作者信息
- 1. 中国电子科技集团公司第十三研究所,石家庄 050299
- 折叠
摘要
Abstract
The solder will scatter and wet on the surface of the solder pad during the welding process.The wetting effect is closely related to the surface tension of the solder,the surface state of the solder pad,and the welding conditions.If solder wetting is poor,it will directly affect the welding area and the welding strength,which will ultimately reduce the welding reliability of the product.Poor wetting occurred during welding of a certain ceramic substrate,and the appearance and composition of the shearing fracture surface are analyzed by scanning electron microscopy and energy-dispersive spectroscopy,and the welding interface is analyzed by slicing.It is found that the nickel layer of the solder pad is too thin,finally leading to the poor wetting.Some countermeasures are presented.关键词
陶瓷基板/SAC305/润湿性/脆性断裂/金脆/失效分析Key words
ceramic substrate/SAC305/wettability/brittle fracture/gold embrittlement/failure analysis分类
信息技术与安全科学引用本文复制引用
陈柱..基于陶瓷基板的焊接润湿性及失效机理研究[J].电子与封装,2026,26(1):10-16,7.
