电子与封装2026，Vol.26Issue(1)：17-21,5.DOI:10.16257/j.cnki.1681-1070.2026.0003
基于电源模块灌封工艺的平面变压器黏接技术
Planar Transformer Bonding Technology Based on Power Module Potting Process
骞涤 1王晓燕 1张存宽1
作者信息
- 1. 陕西雷能电子科技有限公司,西安 710199
- 折叠
摘要
Abstract
The potting process in the power module is the focus in the whole module assembly process,and the planar transformer bonding is the high incidence area of failure.Through finite element simulation analysis and experimental verification,the main factors influencing bonding interface cracking failure are analyzed,including the internal stress of the bonding adhesive,the thermal stress of the internal and external potting adhesive,as well as the long-term thermal coupling creep degradation of the bonding adhesive.From the perspective of assembly process,targeted solutions are proposed.By optimizing adhesive selection,adhesive reinforcement,silicone rubber plugging process,and incorporating stress relief measures,adhesive cracking issues are effectively resolved,achieving reliable bonding of planar transformers.关键词
平面变压器/黏接/电源模块灌封Key words
planar transformer/bonding/power module potting分类
信息技术与安全科学引用本文复制引用
骞涤,王晓燕,张存宽..基于电源模块灌封工艺的平面变压器黏接技术[J].电子与封装,2026,26(1):17-21,5.
