电子与封装2026，Vol.26Issue(1)：22-29,8.DOI:10.16257/j.cnki.1681-1070.2026.0005
半导体先进封装领域专利技术综述
Review on Patent Technologies in the Field of Advanced Semiconductor Packaging
余佳 1马晓波1
作者信息
- 1. 湖南越摩先进半导体有限公司,湖南株洲 412000
- 折叠
摘要
Abstract
With the vigorous development of industries such as AI and high-performance computing,advanced packaging technology is now regarded as a crucial pathway for extending Moore's Law.2.5D and 3D packaging technologies are focused.The patent technology systems centered on packaging structures,interposers,and substrates are systematically reviewed.Furthermore,the innovation points,technical advantages,and market application values of typical patents are analyzed.The patent layout strategies and industrial competition landscape in the field of semiconductor packaging and testing are also revealed.Accordingly,guidance is provided for relevant enterprises in technology research and development as well as patent layout.关键词
半导体封装测试/2.5D封装/3D封装/专利技术/异构集成Key words
semiconductor packaging and testing/2.5D packaging/3D packaging/patent technology/heterogeneous integration分类
信息技术与安全科学引用本文复制引用
余佳,马晓波..半导体先进封装领域专利技术综述[J].电子与封装,2026,26(1):22-29,8.
