| 注册
首页|期刊导航|电子与封装|不同基材的金属封装盖帽对储能焊接工艺的影响

不同基材的金属封装盖帽对储能焊接工艺的影响

宋义雄

电子与封装2026,Vol.26Issue(1):30-35,6.
电子与封装2026,Vol.26Issue(1):30-35,6.DOI:10.16257/j.cnki.1681-1070.2026.0010

不同基材的金属封装盖帽对储能焊接工艺的影响

Influence of Metal Packaging Caps with Different Base Materials on Energy Storage Welding Process

宋义雄1

作者信息

  • 1. 成都天奥电子股份有限公司,成都 610036
  • 折叠

摘要

Abstract

Energy storage welding is a commonly used sealing technique for metal packaging enclosures.In the electronics manufacturing industry,the common materials for packaging caps include zinc cupronickel,Kovar alloy,and stainless steel,whose surfaces are typically treated with electroless nickel plating or electroplated nickel plating.Differences in material properties of various base materials directly affect the sealing yield of energy storage welding.The effects of three base materials(zinc cupronickel,Kovar alloy,and stainless steel)on the sealing yield of energy storage welding are systematically investigated.Based on the distinct characteristics of three base materials,methods to improve the yield of energy storage welding are proposed.Experimental results show that the stainless steel base material achieves a 100%sealing yield at a welding pressure of 0.5 MPa,a voltage of 180 V,and a welding end face flatness deviation controlled within 0.1 mm,due to its ductility and hardness matching the Kovar alloy base material.The high hardness and low deformation of the iron-based Kovar alloy base material enable control of welding end face flatness deviation within 0.04 mm,resulting in a sealing yield improvement from 65.6%to 100%.For the zinc cupronickel base material,due to the low strength and poor deformation resistance,the sealing yield is increased from 76.6%to 100%by not only controlling the welding end face flatness deviation within 0.04 mm but also reducing the welding pressure by 0.1 MPa.

关键词

密封工艺/储能焊接/封装基材/金属封装盖帽

Key words

sealing process/energy storage welding/packaging base material/metal packaging cap

分类

信息技术与安全科学

引用本文复制引用

宋义雄..不同基材的金属封装盖帽对储能焊接工艺的影响[J].电子与封装,2026,26(1):30-35,6.

电子与封装

1681-1070

访问量1
|
下载量0
段落导航相关论文