电子与封装2026，Vol.26Issue(1)：36-47,12.DOI:10.16257/j.cnki.1681-1070.2026.0012
低温银烧结技术的可靠性研究进展
Research Progress on the Reliability of Low-Temperature Silver Sintering Technology
摘要
Abstract
With the rapid development of high-power electronic technology,the operating temperature of chips continues to rise.Sintered micro-and nano-silver,due to their excellent conductivity,thermal conductivity,and mechanical strength,have become one of the most promising high-temperature packaging interconnect materials.However,the reliability of sintered silver joints under long-term high-temperature environments and frequent switching conditions has not been fully validated.By reviewing the reliability research on sintered silver joints in high-temperature aging,thermal cycling,thermal shock and power cycling tests,the material and process reliability of low-temperature silver sintering technology is systematically summarized,and the two key mechanisms leading to joint degradation are deeply analyzed:the thermal driving force effect and thermal stress impact.Through analysis,the current key technical challenges are summarized,and effective strategies to improve the reliability of sintered silver joints are explored.关键词
烧结银/金属化/老化/热应力/可靠性Key words
sintered silver/metallization/aging/thermal stress/reliability分类
信息技术与安全科学引用本文复制引用
王奔,朱志宏,贾少博,汪宝华,丁苏,李万里..低温银烧结技术的可靠性研究进展[J].电子与封装,2026,26(1):36-47,12.基金项目
江苏省自然科学基金(BK20221095) （BK20221095）
