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ZYNQ系列FPGA片内XADC的温度检测自适应分段补偿

盛沨 于治 谢文虎 谢达

电子与封装2026,Vol.26Issue(1):62-67,6.
电子与封装2026,Vol.26Issue(1):62-67,6.DOI:10.16257/j.cnki.1681-1070.2026.0009

ZYNQ系列FPGA片内XADC的温度检测自适应分段补偿

Adaptive Segmented Compensation for Temperature Detection of on-Chip XADC in ZYNQ Series FPGAs

盛沨 1于治 1谢文虎 1谢达1

作者信息

  • 1. 无锡中微亿芯有限公司,江苏无锡 214072
  • 折叠

摘要

Abstract

Research on the temperature detection technology of on-chip Xilinx analog-to-digital converter(XADC)in field-programmable gate array(FPGA)is of great significance for improving the reliability of chip overheating protection and early warning systems.Aiming at the problems of large detection errors and delayed early warning responses in the traditional full-temperature-range linear compensation method inside FPGAs under high and low temperature environments,an adaptive segmented compensation method for high-and low-temperature environments is proposed.Default linear compensation is adopted in the temperature range from-10 ℃ to 30 ℃,while nonlinear compensation is activated when the temperature is below-10 ℃or above 30 ℃.Temperature data during the entire compensation process is processed on the processing system(PS)side of ZYNQ-series FPGA chips,and the advantages of high processing speed and no occupation of programmable logic(PL)side resources are fully leveraged.A collaborative early warning system architecture between the PS and PL sides is constructed,which is triggered timely and effectively,thereby demonstrating the reliability and practicability of the adaptive segmented compensation method.

关键词

FPGA/XADC/温度检测/分段补偿/预警

Key words

FPGA/XADC/temperature detection/segmented compensation/early warning

分类

信息技术与安全科学

引用本文复制引用

盛沨,于治,谢文虎,谢达..ZYNQ系列FPGA片内XADC的温度检测自适应分段补偿[J].电子与封装,2026,26(1):62-67,6.

基金项目

国家重点研发计划(2024YFB4505402) (2024YFB4505402)

江苏省科技重大专项(BG2024032) (BG2024032)

江苏省基础研究计划(BK20243020) (BK20243020)

电子与封装

1681-1070

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