电子元件与材料2026，Vol.45Issue(1)：35-42,8.DOI:10.14106/j.cnki.1001-2028.2026.1333
基于SiP技术的超宽带多通道T/R组件设计
Design of anultra wideband multi-channel RF front-end module based on SiP technology
米从威 1张睿 1陆宇 1袁超1
作者信息
- 1. 中国西南电子技术研究所 复杂航空系统仿真全国重点实验室,四川 成都 610036
- 折叠
摘要
Abstract
To meet the urgent requirements for miniaturization,high integration,and multi-functionality of T/R modules in active phased array systems,System-in-Package(SiP)technology was adopted to integrate multiple chips with diverse functions onto a silicon substrate.Through a three-dimensional stacking design,miniaturized high-power transceiver and frequency-selection microsystem components were successfully realized.By integrating these two types of microsystem components and peripheral circuits on the substrate,a compact ultra-wideband reconfigurable T/R module with 8 receive and 4 transmit channels was developed.The receiving frequency range of the fabricated module spans from 0.3 GHz to 3 GHz,with a noise figure of less than 3.4 dB.Its maximum receiving gain is better than 40.2 dB and can be controlled via a 6-bit digital attenuator.Over the frequency range of 0.9-1.5 GHz,the T/R module provides a pulse power of more than 45.8 dBm and a gain of more than 60.9 dB,while the fluctuation of transmitting power and gain across multiple channels is less than 0.4 dB.The module has a size of 180 mm×106 mm×12 mm,which represents an approximately 36.4%reduction in size compared to traditional T/R modules with similar functions.The excellent performance of the fabricated module proves that the proposed method provides a valuable reference for the design of highly integrated T/R modules.关键词
系统级封装/小型化/微系统/超宽带/T/R组件Key words
System-in-Package/miniaturization/microsystems/ultra-wideband/T/R module分类
信息技术与安全科学引用本文复制引用
米从威,张睿,陆宇,袁超..基于SiP技术的超宽带多通道T/R组件设计[J].电子元件与材料,2026,45(1):35-42,8.
