电子元件与材料2026，Vol.45Issue(1)：43-51,9.DOI:10.14106/j.cnki.1001-2028.2026.1329
高压引信电路仿真与模块一体化设计
Simulation of high-pressure fuze circuit and integrated design of module
赵丹瑞 1刘赣 2邢孟江 3李小珍 4杨圆圆2
作者信息
- 1. 电子科技大学 电子科学与工程学院,四川 成都 611731
- 2. 电子科技大学长三角研究院(湖州),浙江 湖州 310031
- 3. 电子科技大学 电子科学与工程学院,四川 成都 611731||电子科技大学长三角研究院(湖州),浙江 湖州 310031
- 4. 昆明学院 信息工程学院,云南 昆明 650214
- 折叠
摘要
Abstract
To meet the demands for miniaturization,integration,and performance improvement of fuze boost ignition circuits,this study proposed a design method for a fuze module with fast boosting,miniaturization,and high integration based on Low Temperature Co-fired Ceramic(LTCC)technology.Firstly,considering the parasitic parameters of components,by modeling and deriving the flyback boost circuit,we proposed a complete set of boost circuit parameter design methods.Secondly,the flyback boost unit(including high and low voltage sides),capacitor discharge unit,and voltage divider sampling unit were systematically integrated using LTCC technology.Surface mount devices were adopted and the layout was optimized to reduce the area of the discharge loop and enhance the discharge performance.Simulation results show that the peak voltage at the drain of the MOSFET is effectively clamped to 240.2 V(originally 527.3 V);the boost time is shortened to 30 ms(with the boost voltage reaching 1390 V),which represents a 68.9%improvement compared with existing studies.The overall module size measures only 50 mm×22 mm×9.6 mm,enabling system control of the boost and discharge functions while providing real-time monitoring of the boost voltage.关键词
反激升压电路/升压时间/LTCC/小型化/高压引信模块Key words
flyback boost circuit/boost time/LTCC/miniaturization/high-voltage fuze module分类
军事科技引用本文复制引用
赵丹瑞,刘赣,邢孟江,李小珍,杨圆圆..高压引信电路仿真与模块一体化设计[J].电子元件与材料,2026,45(1):43-51,9.
