电子元件与材料2026，Vol.45Issue(2)：173-179,7.DOI:10.14106/j.cnki.1001-2028.2026.1265
三维集成锥形TGV互连结构信号传输性能分析与优化
Analysis and optimization of signal transmission performance of three dimensional integrated TGV interconnection structure
摘要
Abstract
A through-glass via(TGV)is an important vertical interconnection structure in three-dimensional integrated circuits.An electromagnetic simulation model of TGV was established based on the High Frequency Structure Simulator(HFSS)software,and the effects of signal frequency,maximum diameter of through hole,height of through hole and minimum diameter of through hole on the return loss(S11)were analyzed.The response surface method was used to design 17 groups of experimental simulation calculations,and a fitting model of TGV structural parameters and return loss S11 was obtained.The model was then optimized using the genetic algorithm and the results were finally validated.The results show that the S11 of TGV decreases with the increase of signal frequency in the range of 1-10 GHz.The S11 parameter decreases with the increase of the maximum diameter,height and minimum diameter of the through hole.The order of the influence degree of TGV structural parameters on S11 is as follows:via height>maximum via diameter>minimum via diameter.The optimal parameter combination of TGV is as follows:the maximum diameter of the through hole is 70 μm,the height of the through hole is 400 μm,and the minimum diameter of the through hole is 40 μm.Compared with the baseline model,the S11 of the TGV with the optimal parameter combination is reduced by nearly 18.87％,thus achieving the structural optimization of the conical TGV.关键词
玻璃通孔/回波损耗/结构参数/遗传算法/最优组合Key words
through glass via/return loss/structural parameters/genetic algorithm/optimal parameter combination分类
信息技术与安全科学引用本文复制引用
谭丽娟,黄根信,黄春跃,李鹏..三维集成锥形TGV互连结构信号传输性能分析与优化[J].电子元件与材料,2026,45(2):173-179,7.基金项目
国家自然科学基金(62164002) （62164002）
2025年度广西高校中青年教师科研基础能力提升项目(2025KY0262) （2025KY0262）
广西科技重大专项资助项目(桂科AA19046004) （桂科AA19046004）
