电子元件与材料2026，Vol.45Issue(2)：201-207,7.DOI:10.14106/j.cnki.1001-2028.2026.1449
一种高导热驱动电路板的热设计及热仿真分析研究
Thermal design and thermal simulation analysis of a high thermal conductivity drive circuit board
李磊 1黄向华 1张天宏1
作者信息
- 1. 南京航空航天大学 能源与动力学院,江苏 南京 210016
- 折叠
摘要
Abstract
To address the increasing thermal challenges in high-reliability motor drive modules caused by rising power density,effective management of heat generation,transfer,and dissipation must be ensured during the design process.A hybrid thermal conduction and dissipation solution was proposed,combining an FR-4 epoxy-glass laminate with a metallic heat-spreading transition section,to overcome the limitations of poor thermal conductivity in conventional FR-4 substrates and the high cost and fabrication difficulty of all-metal substrates.Top-side heat-dissipating MOSFETs were selected,and major heat-generating components(such as MOSFETs and current-sensing resistors)were mounted on the bottom side of the PCB.These components were thermally connected to the metallic transition section via high-thermal-conductivity silicone pads,establishing an efficient vertical thermal path from the components to an external heatsink while maintaining electrical insulation.A thermal model was developed using ANSYS Icepak,and simulations were conducted under realistic operating power and boundary conditions.The simulation results show that the maximum junction temperature remains below 95℃ under full load,representing a temperature reduction of 30℃ compared to conventional circuit board designs.This approach eliminates the need for expensive metal-core PCBs,achieving both high thermal performance and high reliability.The proposed solution is suitable for medium-and low-power applications such as power supplies,LED drivers,and motor control applications,and provides a cost-effective reference for thermal design of printed circuit boards.关键词
印刷电路板/热分析/高导热/IcepakKey words
PCB/thermal analysis/high thermal conductivity/Icepak分类
信息技术与安全科学引用本文复制引用
李磊,黄向华,张天宏..一种高导热驱动电路板的热设计及热仿真分析研究[J].电子元件与材料,2026,45(2):201-207,7.
